INNOVENT at the Bondexpo
![Logo Bondexpo](/fileadmin/_processed_/f/2/csm_BondExpo_b38686561a.jpg)
Bondexpo is the world's leading industry and user platform in the field of joining and bonding. The focus of Bondexpo is on joining/bonding by means of gluing, moulding, sealing and foaming as well as current and future challenges in these fields.
We welcome you in hall 5 at our booth 5402. Our focus is on the latest research and developments in the field of primers and chemical surface treatment.
We are looking forward to see you there!
![](/fileadmin/_processed_/6/6/csm_logo-de_486271fed2.png)